The ThermoSpot is a new product, introduced in 2015. It provides a thermally-conductive pad that can be pressed down onto, for instance, an Integrated Circuit (IC). The pad can be chilled down to low temperatures to extract heat from the IC, or can be heated-up to thermally stress the IC. So you can temperature-cycle the IC rapidly, without similarly stressing any adjacent circuitry.

This webpage is under construction. Please contact us directly for more information on ThermoSpots.